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| INTEGRATED CIRCUITS DATA SHEET SAA7811HL Single-chip DVD-ROM Preliminary specification File under Integrated Circuits, IC22 1999 Oct 05 Philips Semiconductors Preliminary specification Single-chip DVD-ROM FEATURES Host interface * Enhanced Integrated Drive Electronics (IDE) Advanced Technology Attachment Program Interface (ATAPI) host interface * Built-in 12-byte ATAPI Packet command First-In, First-Out (FIFO) * Supports Advanced Technology Attachment (ATA) and ATA-2 PIO and multi-word Direct Memory Access (DMA) data transfer modes * Supports ATA/ATAPI-4 Ultra DMA transfer modes with data rate up to 33 MBytes/s * Configurable as generic DMA interface, for use with external host interface devices * Automatic sequencing of ATAPI packet command protocol; including command termination * Automatic determination of block length for mode2, form 1 and form 2 sectors (block length transferred is programmable). Block decoder * Supports CD-ROM, CD-R and CD-R/W; CD-DA and DVD-ROM formats * Supports real time error detection and correction in hardware for CD-ROM mode * CD-ROM error corrector switchable between single or dual pass (both with Error Detection/Correction [EDC]) * Internal registers are memory-mapped * Embedded DVD-video authentication module. Buffer memory controller * Supports up to 2 MBytes of DRAM buffer * Block based sector addressing. Channel decoder * Selectable differential and single-ended HF inputs; compatible with TZA1033 (DVDalas2plus) and TZA1020A (Aeger2); single-ended input has bypassable AGC * Internal 6-bit ADC * Digital PLL and slicer for HF clock regeneration * Supports Eight-to-Fourteen Modulation (EFM) and EFM+ demodulation * Full CD error correction strategy; t = 2 and e = 4 SAA7811HL * On-chip CD error corrector memory with 8 frame jitter margin * Built-in hardware for double pass DVD error corrector; (can correct 5 errors in C1 frame and 16 errors in C2 frame) * Error corrector monitor signal available * I2C-bus output available via programmable vampire pins. Spindle motor control * Advanced motor control loop allows Constant Angular Velocity (CAV), Constant Linear Velocity (CLV) and pseudo-CLV playback * Support for 3-pin and 1-pin tacho control * Motor control via incoming bit stream or tacho. Speed operation * Supports up to 56 x CD-ROM playback * Supports up to 10 x DVD-ROM playback. Multimedia functions and built-in DAC * Supports audio playback via DRAM buffer; allows audio discs to be played at higher speeds * IEC958 (SPDIF, AES/EBU and DOBM) output with Q to W subcode bits and programmable category code, output at n = 1 rate * Built-in digital audio DAC including: -4 x oversampling filter * Built-in digital volume control, attenuator and single-sample interpolator * Separate left and right channel routing and mute control. Microcontroller interface * Embedded microcontroller can operate as 33 MHz or 67 MHz equivalent 80C51 * Embedded co-processor for fast multiply, divide, shift, and normalize instructions; supported by C-compilers * Co-processor for MSF calculations * Memory mapped interfaces to sub functions * External microcontroller support 1999 Oct 05 2 Philips Semiconductors Preliminary specification Single-chip DVD-ROM * Embedded SRAM (1.5 kbytes Xdata, 512 bytes Idata, 224 bytes data and registers) * 4 banks: on Idata and registers; for better multi-tasking support * External flash EPROM programming support - Serial boot possible with empty flash EPROM - Internal program upload support. * Code space support up to 1 Mbyte through built-in bank switching * Debug interface for embedded microcontroller. Servo processor * Switched current analog-to-digital converters for diode and error signal inputs * Selectable servo error or servo diode inputs * Focus and radial servo loops * Automatic closed loop gain control available for focus and radial loops * Built-in access procedure with fast track count input * High-speed track crossing velocity measurement (>350 kHz) for CD and DVD * Special DVD track crossing support * Fast radial brake circuitry * EFM actuator damping circuitry QUICK REFERENCE DATA SYMBOL VDDD(CO) VDDD1(3P) VDDD2(5P) VDDA IDD fXTAL Tamb Tstg Note PARAMETER supply voltage digital part core; note 1 supply voltage digital part pad cells 3 V supply voltage digital part pad cells 5 V supply voltage analog part; note 1 supply current crystal frequency operating ambient temperature storage temperature MIN. 3.0 3.0 4.5 3.0 - 8 0 -55 TYP. 3.3 3.3 5.0 3.3 tbf 8.4672 - - Clock multiplier SAA7811HL * Sledge motor servo loop with enhanced Position Control Sledge (PCS) support * Sledge stepper motor support * Adaptive Repetitive Control (ARC) * Debug interface for servo. * On-chip clock multipliers allows the use of 8.4672 MHz crystal. Disclaimer Supply of this Compact Disc IC does not convey an implied license under any patent right to use this IC in any Compact Disc application. GENERAL DESCRIPTION The SAA7811 is a single-chip device for high speed DVD-ROM applications. The device contains the following blocks previously contained in separate ICs: * channel decoder * block decoder * servo processor * microcontroller. MAX. 3.6 3.6 5.5 3.6 - 35 60 +125 V V V V UNIT mA MHz C C 1. The analog and digital core supply pins (VDDA and VDDD(CO)) must be connected to the same external supply. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME SAA7811HL 1999 Oct 05 LQFP208 DESCRIPTION plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm 3 VERSION SOT459-1 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 1999 Oct 05 CHANNEL DECODER CD/DVD ERROR CORRECTOR MEMORY PROCESSOR BLOCK DIAGRAM Philips Semiconductors Single-chip DVD-ROM BLOCK DECODER INTERFACE DRAM INTERFACE MEMORY PROCESSOR HOST INTERFACE MULTIMEDIA INTERFACE DAC ADC BIT DETECTOR AND DEMODULATOR DRIVE INTERFACE MOTOR/ TACHO INTERFACE ERROR CORRECTOR SUBCODE INTERFACE SAA7811 CSS MODULE Fig.1 Block diagram. handbook, full pagewidth 4 CONTROL REGISTERS CPU INTERFACE SERVO ADC ADC PCS ACCELERATOR SERVO ACCELERATOR RAM SERVO PROCESSOR ADDRESS DECODER 1.5 KBYTES AUXILIARY RAM SFRs CPU 1.5 KBYTES ROM 736-BYTE RAM PORT REGS MICROCONTROLLER Preliminary specification SAA7811HL FCE404 Philips Semiconductors Preliminary specification Single-chip DVD-ROM PINNING See note 1 SYMBOL VDDD1(3P) VSSD1(3P) T1 T2 T3 DAC/RP DAC/RN DAC_VPOS DAC_VNEG DAC_LP DAC_LN TEST1 TEST2 CRIN CROUT VDDA VSSA HFIN_DN HFIN_DP HFIN_SE VCOM Iref WREFLO TEST3 VSSA VDDA SIN_PHI COS_PHI TEST4 XDET ACT_EMFP ACT_EMFN TEST5 TEST6 TEST7 UOPB UOPT ALPHA0 VSSA 1999 Oct 05 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 pad digital supply (3.3 V) pad digital ground (3.3 V) tacho 1 input, tcb_tck_pregate tacho 2 input tacho 3 input DESCRIPTION SAA7811HL DAC differential output right (positive)/debug signal from MACE (opc_int) DAC differential output right (negative)/debug signal from MACE (servo_int) DAC Vref (positive) DAC Vref (negative) DAC differential output left (positive)/debug signal from MACE (dakota_int0) DAC differential output left (negative)/debug signal from MACE (dakota_int1) test input, tcb_tms and tcb_tdi connected to an internal pull-down resistor test input, tcb_trstn connected to an internal pull-down resistor clock input clock output analog supply (3.3 V) analog supply ground differential HF in (negative) differential HF in (positive) single-ended HF in (AGC) common mode reference signal (DVDalas2plus) analog current reference Vref low; connect to VSSA via capacitor test input; connect to VSSA analog supply ground analog supply (3.3 V) sine input from hall detectors cosine input from hall detectors test input; connect to VSSA auxiliary ADC input EMF of the actuator; positive input EMF of the actuator; negative input test input; connect to VSSA test input; connect to VSSA test input; connect to VSSA decoupling point for ADC ladder upper reference voltage for ADC ladder gain control for TZA1030 (DROPPI) analog supply ground 5 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL SYMBOL VDDA D1 D2/TLN D3/REN D4/FEN S1/MIRN S2 VRIN FTCH P5_7/DEFO P5_6/DEFI P5_5/TL P5_4/RP/FOK P5_3/CE1 P5_2/CLO P5/SDA P5_0/SCL RA SL FO RAC_SW REF_SIN REF_COS VDDD1(3P) VSSD1(3P) P4_7/PXT2EN P4_6/PXT2 P4_5/PXT0 P4_4/PXT VDDD(3CO) VSSD(3CO) P4_3/A19 P4_2/A18 P4_1/A17 P4_0/A16 UA15 UA14 UA13 UA12 UA11 UA10 1999 Oct 05 PIN 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 analog supply (3.3 V) diode input DESCRIPTION diode input (normalized); track-loss signal diode input (normalized); radial error signal diode input (normalized); focus error signal satellite diode (normalized); mirror signal satellite diode I/O voltage reference; for servo ADC track count input defect output (active LOW)/general purpose I/O defect input (active LOW)/general purpose I/O track-loss means output/general purpose I/O radial polarity/focus OK/general purpose I/O CS external SRAM/programmable I/O servo clock output/alpha0 step pulse for LADIC I2C-bus data/general purpose I/O I2C-bus clock/general purpose I/O radial output (3-state during reset) sledge output (3-state during reset) focus output (3-state during reset) disconnects radial actuator (active HIGH) pulse density modulated reference signal; removes DC offset from sin_phi pulse density modulated reference signal; removes DC offset from cos_phi pad digital supply (3.3 V) pad digital ground (3.3 V) timer 2 input enable/SIDA for DVDalas2plus timer 2 clock input/SICL for DVDalas2plus timer 1 clock input/SILD for DVDalas2plus timer 0 clock input/CS2 for external device core digital supply (3.3 V) core digital ground A19 to EPROM A18 to EPROM A17 to EPROM A16 to EPROM port 2; upper microcontroller address lines port 2; upper microcontroller address lines port 2; upper microcontroller address lines port 2; upper microcontroller address lines port 2; upper microcontroller address lines port 2; upper microcontroller address lines 6 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL SYMBOL UA9 UA8 VDDD1(3P) VSSD1(3P) EA_WAIT DSDEN_SRST SCCLK PSENN_CS ALE_ASTB VDDD(3CO) VSSD(3CO) UA7_P1_7 UA6_P1_6 UA5_P1_5 UA4_P1_4 UA3_P1_3 UA2_P1_2 UA1_P1_1 UA0_P1_0 VDDD1(3P) VSSD1(3P) UDA0 UDA1 UDA2 UDA3 UDA4 UDA5 UDA6 UDA7 P3_7/RD P3_6/WR P3_5/TXD2 P3_4/RXD2 VDDD1(3P) VSSD1(3P) P3_3/INT1 P3_2/INT0 P3_1/TXD1 P3_0/RXD1 HRESET VDDD2(5P) 1999 Oct 05 PIN 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 DESCRIPTION port 2; upper microcontroller address lines port 2; upper microcontroller address lines pad digital supply (3.3 V) pad digital ground (3.3 V) address input/wait output internal pull-up resistor (active LOW) microcontroller reset microcontroller clock for testing programme strobe enable/output enable for external device internal pull-up resistor address latch; chip select internal pull-up resistor core digital supply (3.3 V) core digital ground port 1; demultiplexed lower microcontroller address lines (mode3 = vampire7; V4) port 1; demultiplexed lower microcontroller address lines (mode3 = vampire6; SYNC) port 1; demultiplexed lower microcontroller address lines (mode3 = MON_D) port 1; demultiplexed lower microcontroller address lines (mode3 = MON_A) port 1; demultiplexed lower microcontroller address lines (mode3 = DEB_OUT) port 1; demultiplexed lower microcontroller address lines (mode3 = OTD) port 1; demultiplexed lower microcontroller address lines port 1; demultiplexed lower microcontroller address lines pad digital supply (3.3 V) pad digital ground (3.3 V) port 0; multiplexed microcontroller data/lower address lines port 0; multiplexed microcontroller data/lower address lines port 0; multiplexed microcontroller data/lower address lines port 0; multiplexed microcontroller data/lower address lines port 0; multiplexed microcontroller data/lower address lines port 0; multiplexed microcontroller data/lower address lines port 0; multiplexed microcontroller data/lower address lines port 0; multiplexed microcontroller data/lower address lines read signal (active LOW) write signal (active LOW) UART 2 transmit data line UART 2 receive data line pad digital supply (3.3 V) pad digital ground (3.3 V) interrupt 1 input/programmable I/O interrupt 0 input/programmable I/O UART 1 transmit data line UART 1 receive data line host reset pad digital supply (5.0 V) 7 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL SYMBOL VSSD5(pad3) DD7 DD8 DD6 DD9 DD5 DD10 DD4 DD11 DD3 DD12 DD2 DD13 DD1 DD14 DD0 DD15 VDDD2(5P) VSSD2(5P) DMARQ/GACK DIOW DIOR IORDY DMACK/GRQ INTRQ IOCS16 DA1_GWR PDIAG DA0 DA2_GRD VDDD2(5P) VSSD2(5P) CS0 CS1 DASP VDDD1(3P) VSSD1(3P) XDA0 XDA1 XDA2 XDA3 1999 Oct 05 PIN 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 pad digital ground (5.0 V) host interface; generic DMA DESCRIPTION host interface; generic DMA (mode1 = MEAS1_CFLG) host interface; generic DMA host interface; generic DMA (mode1 = MEAS1) host interface; generic DMA host interface; generic DMA (mode1 = MON_A) host interface; generic DMA host interface; generic DMA (mode1 = MON_D) host interface; generic DMA host interface; generic DMA (mode1 = DEB_OUT) host interface; generic DMA host interface; generic DMA (mode1 = OTD) host interface; generic DMA host interface; generic DMA host interface; generic DMA host interface; generic DMA pad digital supply (5.0 V) pad digital ground (5.0 V) host DMA request; generic DMA acknowledge host interface write strobe host interface read strobe host interface ready host DMA acknowledge; generic DMA request host interface interrupt request host interface 816 bit port host add bit 1; generic write host interface passed test (mode1 = vampire6; SYNC) host add bit 0 host add bit 2; generic read pad digital supply (5.0 V) pad digital ground (5.0 V) host interface chip select 0 host interface chip select 1 host interface active slave present (mode1 = vampire7; V4) pad digital supply (3.3 V) pad digital ground (3.3 V) DRAM address DRAM address DRAM address DRAM address 8 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL SYMBOL XDA4 XDA5 XDA6 XDA7 XDA8 XDA9 VDDD(3CO) VSSD(3CO) XRAS XCAS_HI XCAS_LO XWR VDDD1(3P) VSSD1(3P) XDD0 XDD1 XDD2 XDD3 XDD4 XDD5 XDD6 XDD7 XDD8 XDD9 XDD10 XDD11 XDD12 XDD13 XDD14 XDD15 VSSD1(3P) VDDD1(3P) IECO/CL1 MCK VDDD(3CO) VSSD(3CO) WCLK_WSI BCLK_SCKI DATA_SDI FLAG TEST8 1999 Oct 05 PIN 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 DRAM address DRAM address DRAM address DRAM address DRAM address DRAM address core digital supply (3.3 V) core digital ground DRAM RAS strobe DRAM CAS strobe DRAM CAS strobe DRAM write strobe pad digital supply (3.3 V) pad digital ground (3.3 V) DRAM data bus DRAM data bus DRAM data bus DRAM data bus DRAM data bus DRAM data bus DRAM data bus DRAM data bus DRAM data bus DRAM data bus DRAM data bus DRAM data bus DRAM data bus DRAM data bus DRAM data bus DRAM data bus pad digital ground (3.3 V) pad digital supply (3.3 V) DESCRIPTION IEC958 output/CL1 output from HDr62 multimedia master clock input/output (mode2 = MEAS_CFLG) core digital supply (3.3 V) core digital ground I2C-bus word clock output/input (mode2 = MEAS1) I2C-bus bit clock output/input (mode2 = MON_D) I2C-bus data output/input (mode2 = MON_A) I2C-bus flag output/input (mode2 = DEB_OUT) test output; leave unconnected 9 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL SYMBOL TEST9 TEST10 POR BCA MOTO1 Note PIN 204 205 206 207 208 test output; leave unconnected test output; leave unconnected Power-on reset (active LOW) BCA input motor control output DESCRIPTION 1. All supply pins must be connected to the same external power supply voltage. 208 handbook, halfpage 157 1 156 SAA7811HL 52 105 FCE405 53 Fig.2 Pin configuration. 1999 Oct 05 10 104 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL CHARACTERISTICS VDDD(3CO) = 3.0 to 3.6 V; VDDD1(3P) = 3.0 to 3.6 V; VDDA = 3.0 to 3.6 V; VDDD2(5P) = 4.5 to 5.5 V; VSS = 0 V; Tamb = 0 to 60 C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS - 1 3 MIN. TYP. - 46.6 5 1.4 MAX. UNIT Pins: HFIN_DN and HFIN_DP fclk(sample) Brec Nbit(eff) Vi(dif)(p-p) clock frequency sample rate recovered bandwidth effective number of bits differential input signal voltage (peak-to-peak value) single-ended input signal voltage (peak-to-peak voltage) differential offset voltage common mode offset voltage ADC offset voltage static input capacitance input resistance group delay input to ground input to input Ri td(g) Pin: HFIN_SE fclk(sample) Brec GAGC THD S/N Vi(se)(p-p) clock frequency sample rate recovered bandwidth AGC gain (32 steps) total harmonic distortion signal to noise ratio and distortion of AGC single-ended input signal voltage (peak-to-peak voltage) static input capacitance input resistance group delay flatness 0 to 35 MHz signal = 25 MHz; at Vdif = 1.4 V(p-p) - - -2.1 - - 0 dB; depends on VDDA - - 35 - - 50 0.7 - - +11.4 -35 - 0.7VDDA MHz MHz dB dB dB V Nyquist fclk(sample) = 140 MHz 140 - - 1.4VDDA V MHz MHz - - 0 dB; depends on VDDA - Vi(se)(p-p) 0 dB; depends on VDDA - 0.7 1.7VDDA V Voffset(dif) Voffset(cm) Voffset(ADC) Ci VHFIN_DP; VHFIN_DN -100 -200 -60 - - - - - - - 7 3 - +100 +100 +60 - - - 100 mV mV mV pF pF k ps Ci Ri td(g) Ii/o(max) Vi Gtol input to ground - - - 1 - -20 7 8.6 - - VVRIN 0 - - 600 pF k ps A V % Pins: D1, D2/TL, D3/RE, S1/MIR and S2 maximum input/output current voltage at input gain tolerance selectable via gain; note 1 16 - +20 1999 Oct 05 11 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL SYMBOL G PARAMETER variation of gain between channels (D1 to D2/TL, D3/RE to D4/FE and S1/MIR to S2) maximum parasitic capacitance connected to input clock frequency sample rate recovered bandwidth total harmonic distortion-plus-noise to signal ratio dynamic range CONDITIONS -2 MIN. TYP. - +2 MAX. UNIT % Cpar(max) - - 25 pF fclk Brec (THD + N)/S - - Isink or Isource = 6 A - 8.4672 - 20 - - -30 MHz kHz dB DR Pin: VRIN Vo(VRIN) Vi(VRIN) Pin: FTCH Isink or Isource = 6 A 50 - 0.9 - - - 1.2 7 - 0 2.9 - tbf 5 265 100 7 - - 7 - 1.05 1 V 2 DDA dB output voltage input voltage 0.75 1.0 -20 -10 - - input to ground - 100 - - 0 - note 2 - - 80 - 0 -1 - - 12 V + 0.1 V V(comp)(offset)(FTC) comparator FTC offset voltage V(comp)(hys)(FTC) Vcm fsample Ci Ri Vi(UOPB) Vi(UOPT) Vi Vcm G B Ri Ci Vi G Ri Ci(static) 1999 Oct 05 comparator FTC hysteresis voltage common mode voltage sample rate input capacitance input resistance +20 +10 - - - - - Vi(UOPT) - - - 120 - V(UOPT) +1 - - mV mV V MHz pF k 8.4672 - Pins: UOPB and UOPT input voltage on UOPB input voltage on UOPT V V Pins: ACT_EMFP and ACT_EMFN input voltage common mode voltage gain bandwidth input resistance static input capacitance V V V kHz k pF Pins: SIN_PHI, COS_PHI, XDET and ACT_EMFP; note 3 input voltage gain matching between channels input resistance static input capacitance V % k pF Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL SYMBOL Ci(dynamic) fclk(sample) Brec Nbit(eff) CODEminvi CODEmaxvi Pin: ALPHA0 fclk Vo CL RL fclk B S/NAW THD Digital inputs PARAMETER dynamic input capacitance clock frequency sample rate recovered bandwidth effective number of bits output code for Vi(UOPB) input output code for Vi(UOPT) input CONDITIONS - - 5 at 1.05 MHz - 0 251 MIN. TYP. 5 1.05 - 7.2 5 253 - - - - 10 255 MAX. UNIT pF MHz kHz clock frequency sample rate output voltage load capacitance load resistance - 0 - 10 - - 90 - 1.05 - - - 4.236 - - - - Vi(UOPT) 25 30 - 20 - -80 MHz V pF k Pins: DAC_LN, DAC_LP, DAC/RN and DAC/RP clock frequency sample rate frequency bandwidth A-weighted signal-to-noise note 4 ratio total harmonic distortion note 4 MHz kHz dB dB POR, HRESET AND BCA (SCHMITT TRIGGERS) TTL INPUT WITH HYSTERESIS Vsw(th)(r) Vsw(th)(f) Vhys CI DESIGNATED BY switching threshold voltage (rising) switching threshold voltage (falling) hysteresis voltage input capacitance `T' TTL INPUT; note 5 LOW-level input voltage HIGH-level input voltage input leakage current input capacitance VLI = 0 to VDDD1(3P) 1.4 0.9 0.4 - - 2.0 -10 - - - - - - - - - 1.9 1.45 0.7 10 V V V pF VIL VIH ILI Ci Digital outputs DESIGNATED BY 0.8 - +10 10 V V A pF `L' (CMOS LEVELS) LOW-level output voltage HIGH-level output voltage load capacitance IOL = 2 mA IOH = -2 mA - - - - 0.4 - 20 V V pF 0.85VDDD1(3P) - VOL VOH CL 1999 Oct 05 13 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL SYMBOL to(r) to(f) DESIGNATED BY PARAMETER output rise time output fall time `M' (CMOS LEVELS) LOW-level output voltage HIGH-level output voltage load capacitance output rise time output fall time 3-state leakage current `AL' (ATA DATA BUS LEVELS) LOW-level output voltage HIGH-level output voltage load capacitance output rise time output fall time `AH' (ATA LEVELS) LOW-level output voltage HIGH-level output voltage load capacitance output rise time output fall time CONDITIONS CL = 20 pF; 10% to 90% levels CL = 20 pF; 90% to 10% levels - - MIN. TYP. - - 20 20 MAX. UNIT ns ns VOL VOH CL to(r) to(f) IL(3-state) DESIGNATED BY IOL = 4 mA IOH = -4 mA CL = 20 pF; 10% to 90% levels CL = 20 pF; 90% to 10% levels VLI = 0 to VDDD1(3P) IOL = 4 mA IOH = -4 mA - - - - -10 - 0.9VDDD2(5P) - - - - - - - - - - - 0.4 - 20 20 20 +10 V V pF ns ns A V V pF ns ns 0.85VDDD1(3P) - VOL VOH CL to(r) to(f) DESIGNATED BY 0.5 - 100 - - CL = 100 pF; 5 0.5 V to 90% VDDD2(5P) 5 CL = 100 pF; 90% VDDD2(5P) to 0.5 V IOL = 12 mA IOH = -4 mA - 0.9VDDD2(5P) - CL = 100 pF; 5 0.5 V to 90% VDDD2(5P) CL = 100 pF; 5 90% VDDD2(5P) to 0.5 V -0.3 2.0 relative to period 45 -10 - note 6 - - VOL VOH CL to(r) to(f) - - - - - 0.5 - 100 - - V V pF ns ns Input: CRIN (external clock) VIL VIH tIH ILI Ci Output: CROUT fXTAL gm(mutual) crystal frequency mutual conductance at start-up 8.4672 - 17 - MHz mA/V LOW-level input voltage HIGH-level input voltage input HIGH time input leakage current input capacitance - - - - - +0.5 VDDA + 0.3 55 +10 7 V V % A pF 1999 Oct 05 14 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SAA7811HL SYMBOL C(feedback) Co Rbias Notes PARAMETER feedback capacitance output capacitance internal bias resistor CONDITIONS - - - MIN. TYP. - - 200 2 7 - MAX. UNIT pF pF k 1. Clips at maximum gain setting; input can handle two times the maximum signal amplitude. 2. Gain depends on application components. 3. Pin ACT_EMFP operating in bypass mode. 4. Performance largely determined by application circuit. 5. Does not apply to pins EA_WAIT, PSENN_CS and ALE_ASTB as they have internal pull-up resistors. 6. It is recommended that the nominal running series resistance of the crystal or ceramic resonator is 60 . 1999 Oct 05 15 Philips Semiconductors Preliminary specification Single-chip DVD-ROM PACKAGE OUTLINE LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm SAA7811HL SOT459-1 c y X A 156 157 105 104 ZE e E HE A A2 A1 (A 3) Lp L detail X wM bp pin 1 index 208 53 1 52 e bp D HD wM ZD B vM A vM B 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.15 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.20 0.09 D (1) 28.1 27.9 E (1) 28.1 27.9 e 0.5 HD HE L 1.0 Lp 0.75 0.45 v 0.12 w 0.15 y 0.1 ZD 1.43 1.08 ZE 1.43 1.08 7 0o o 30.15 30.15 29.85 29.85 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT459-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-10-02 98-06-17 1999 Oct 05 16 Philips Semiconductors Preliminary specification Single-chip DVD-ROM SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: SAA7811HL * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 1999 Oct 05 17 Philips Semiconductors Preliminary specification Single-chip DVD-ROM Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable suitable(2) recommended(3)(4) recommended(5) suitable not not suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not SAA7811HL REFLOW(1) 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 1999 Oct 05 18 Philips Semiconductors Preliminary specification Single-chip DVD-ROM DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values SAA7811HL This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1999 Oct 05 19 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999 Internet: http://www.semiconductors.philips.com SCA 68 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545006/01/pp20 Date of release: 1999 Oct 05 Document order number: 9397 750 06164 |
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